Riber, a leading supplier of molecular beam epitaxy (MBE) equipment and services to the compound semiconductor industry, signed an agreement with imec to further collaborate on epitaxy process technologies for next-generation III-V CMOS devices. The agreement follows a successful collaboration in the field of advanced channel materials for high-performance CMOS scaling, germanium and compound semiconductor (III-V) materials. In the new project, the suitability of Riber’s 300 mm UHV chamber (I...